| abstract |
The invention relates to a method for manufacturing a micro-electro-mechanical component, and the micro-electro-mechanical component. The method includes steps as follows: sealing a micro-electro-mechanical chip part by means of a cover part, the cover part includes an introduce structure passed through the cover part for providing electrical connection; jointing the micro-electro-mechanical component to a first surface of an electronic circuit part by virtue of a first jointing member to joint the micro-electro-mechanical chip part and the electronic circuit part mutually, wherein, the cover part of the micro-electro-mechanical component faces the electronic circuit part, and the first surface of the electronic circuit is larger than the micro-electro-mechanical chip part and closes to the micro-electro-mechanical chip part. A second jointing member for externally connecting with the micro-electro-mechanical component is manufactured on the first surface of the electronic circuit part, the second jointing member is a bulge connection member, and the height of the bulge connection member at least is equal to the total height of the micro-electro-mechanical chip component and the first jointing member. |