http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104902696-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-465 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 2015-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104902696-B |
| titleOfInvention | A kind of method that copper post is made based on structure of sunkening cord on a printed circuit board |
| abstract | A kind of method for making copper post on a printed circuit board based on structure of sunkening cord, comprises the following steps：1) copper post will be formed and is attached to support plate surface with copper foil；2) copper wire figure is made by graphic plating method in the one side for forming copper post copper foil；3) structure of sunkening cord is formed in copper wire graphic design pressure dielectric layer material；4) making of sandwich construction is completed using lamination and copper wire graphic making technique；5) supporting plate is removed；6) copper post is made by graphic plating with the one side of copper foil in formation copper post；7) the circuit board one side for not forming copper post sticks protective layer；8) copper foil of etching removal printed circuit board copper post side obtains copper post；9) protective layer is removed；10) circuit board surface makes solder mask, copper post surface makes antioxidation coating, that is, obtains the printed circuit board with chip interconnection docking Copper column structure. |
| priorityDate | 2015-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.