http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104900536-B

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filingDate 2015-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104900536-B
titleOfInvention A kind of surface treatment method of semiconductor lead frame
abstract The invention discloses a kind of surface treatment method of semiconductor lead frame; include successively ultrasonic oil removal, electrolytic degreasing, washing, in sulfuric acid and activation, washing, electro-coppering, washing, acid neutralize, washing, copper protection, washing, hot water wash and drying, the concrete technology that the copper is protected require be:Semiconductor lead frame is imported in protection liquid to soak and has reached the purpose for enclosing Cu protective film, the pH of the protection liquid is 5~7, and temperature is 20~40 DEG C, and soak time is 10~20S, and the protection liquid includes following composition:Alkyl benzimidazole:9~15g/L;1~3g/L of acetic acid.The present invention is provided with one layer of organic protection layer to replace membrane layer in copper superficial layer, and in tin sticky and weldering aluminum steel, this protective layer eliminates naturally, has the function that protection and does not influence welding effect.
priorityDate 2015-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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