http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104854265-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 |
| filingDate | 2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104854265-B |
| titleOfInvention | Electroless copper bath composition |
| abstract | The present invention relates to the acid plating bath deposited for copper and copper alloy, it is used for manufacturing printed circuit board (PCB), IC substrates, semiconductor and the glass device for electronic application.The plating bath of the present invention includes all including amino residue on copper ion, at least one acid and two ends and without the urylene polymer for organically combining halogen.The plating bath is used especially for copper filling concave type structure and builds stud bumps structure. |
| priorityDate | 2012-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.