http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104851857-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427 |
| filingDate | 2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104851857-B |
| titleOfInvention | A chip cooling system |
| abstract | The invention relates to a chip cooling system, comprising a chip heat conduction plate for primary heat exchange and an annular heat pipe for secondary heat exchange. Several fine channels are arranged side by side on the chip heat conduction plate, and the fine channels are simultaneously connected to a A circulation pipeline with a pump is formed to form a circulation loop, and the circulation loop is filled with liquid I; the annular heat pipe is sleeved with the circulation loop to form a sleeve structure, and the annular heat pipe is filled with liquid II and gas, and the gas The pressure is always less than atmospheric pressure. The present invention combines micro-channels and ring-shaped heat pipes to form a two-stage heat exchange system, wherein the micro-channels can provide a large heat dissipation heat flux density and can absorb heat on the chip in time, and the ring-shaped heat pipes fully utilize the effects of phase change and gravity as driving forces to dissipate heat. High efficiency and low cost; the heat is dissipated from the chip through the circulation loop and the annular heat pipe to the environment, with high heat dissipation power and good effect. |
| priorityDate | 2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 189.