http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104851837-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1617 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1675 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1617 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2015-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104851837-B |
| titleOfInvention | Electroless deposition of continuous platinum layers |
| abstract | The present invention relates to the electroless deposition of continuous platinum layers and in particular provides a method for providing electroless plating of platinum-containing layers. Provides a stable solution of Ti 3+ . Provides Pt 4+ stable solutions. The stream of the Ti 3+ stable solution is mixed with the stream of the Pt 4+ stable solution and water to provide a diluted mixture of the Ti 3+ stable solution and the Pt 4+ stable solution. The substrate was exposed to the diluted mixture of the Ti 3+ stabilizing solution and the Pt 4+ stabilizing solution. |
| priorityDate | 2014-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.