http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104851826-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2363-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2398-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-0046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-1018 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-0015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67126 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2015-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104851826-B |
| titleOfInvention | Vacuum laminating apparatus and method for manufacturing semiconductor device |
| abstract | The present invention provides a vacuum laminating apparatus used in manufacturing a semiconductor device, comprising a frame structure surrounding at least a side surface of a sealing material with a supporting substrate, wherein the sealing material with the supporting substrate is formed by laminating a thermosetting resin layer as the sealing material on the supporting substrate, the frame structure comprises a holding means for holding a substrate with a semiconductor element or a wafer with the semiconductor element formed thereon and making the substrate or the wafer opposite to the thermosetting resin layer of the sealing material with the supporting substrate with a space therebetween, and the apparatus performs vacuum lamination of the sealing material with the supporting substrate surrounded by the frame structure and the substrate or the wafer. Thus, particularly even when a large-area substrate (or wafer) is used, generation of voids in the resin layer and warpage of the substrate (or wafer) are suppressed, and a semiconductor device in which the resin layer is molded with high accuracy can be manufactured at low cost. |
| priorityDate | 2014-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 86.