http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104797669-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2413-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2409-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2413-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8426 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J109-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J121-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-00 |
| filingDate | 2013-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104797669-B |
| titleOfInvention | Adhesive composition, adhesive sheet and electronic device |
| abstract | The present invention is an adhesive composition containing a diene-based rubber (A) having a radiation-curable functional group, and a cured adhesive layer with a thickness of 60 μm formed by the curing reaction of the adhesive composition at a temperature of 40° C., The water vapor permeability in an environment with a relative humidity of 90% is 30 g/(m 2 ·day) or less; an adhesive sheet having an adhesive layer formed using the adhesive composition, and an adhesive sheet having an adhesive combination using the above-mentioned adhesive composition Electronic devices formed of encapsulated materials. According to the present invention, it is possible to provide an adhesive composition useful as a material for forming an adhesive layer having excellent moisture resistance and an excellent balance between adhesive force and holding force, and an adhesive layer having an adhesive layer formed using the adhesive composition can be provided An adhesive sheet of , and an electronic device having a sealing material formed using the above-mentioned adhesive composition. |
| priorityDate | 2012-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.