http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104752331-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104752331-B
titleOfInvention A kind of silicon hole lithographic method
abstract A kind of silicon hole lithographic method to reduce the recess of through-silicon via sidewall, including:It places on the pedestal in pending substrate to reaction chamber, includes insulation material layer and the silicon material layer above insulation material layer on the pending substrate, further include patterned mask layer opening above silicon material layer;Reaction gas is passed through to the reaction chamber, is applied in source radio-frequency power to the reaction chamber, plasma is formed, Open Side Down etches and form silicon hole from Patterned masking layer;Pass through a biasing radio-frequency power supply output biasing radio-frequency power to the pedestal;It is characterised in that it includes it is in impulse type to bias radio-frequency power at least one stage, output power switches between high-power output step and low-power output step, and the duty ratio of the biasing RF power pulses is less than 10%.
priorityDate 2013-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

Total number of triples: 14.