http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104742492-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41C1-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2013-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104742492-B |
| titleOfInvention | A kind of double coating positive-printing heat-sensitive CTP plate materials |
| abstract | The invention discloses a kind of double coating positive-printing heat-sensitive CTP plate materials, and in particular to application of the sulfamide-formaldehyde resin in positive-printing heat-sensitive CTP plate material.Technical problems to be solved are that the unexposed portion alkali resistance of plate precursor is poor, and hardness softens, and plate development latitude diminishes.The present invention is a kind of double coating positive-printing heat-sensitive CTP plate materials, resin bed and heat-sensitive layer are scribbled successively on the support of water-wetted surface, resin bed includes film-forming resin, alkali soluble resin, coloring background dye and development accelerant etc., heat-sensitive layer includes phenolic resin, infrared absorbing agents, the molten chaotropic agent of resistance and coloring background dye etc., addition resin in the positive heat-sensitive planographic plate sheet material resin bed is that adjacent or p toluene sulfonamalde formalde hyde resin, its structure areļ¼ Wherein n is that 23, CH3 is adjacency pair tolyl.Using the present invention after such technical scheme, there is good tolerance and pressrun. |
| priorityDate | 2013-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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