| abstract |
The present invention relates to a kind of method for manufacturing microcarrier, it comprises the steps of (a) and provides a kind of wafer (6) with sandwich, it comprises bottom (7), top layer (8) and be positioned at described bottom and top layer (7, 8) insulating barrier (9) between, b () etches away top layer (8) to delineate the sidewall (12) of the body (11) of microcarrier, (c) at least upper surface (14) in body (11) upper deposition the first active layer (13), d continuous print polymeric layer (16) is coated on the first active layer (13) by (), e () etches away bottom (7) and insulating barrier (9), f () removes polymeric layer (16) to discharge microcarrier. |