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filingDate 2013-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104704137-B
titleOfInvention Surface treatment copper foil, the manufacture method of surface treatment copper foil, the negative material of negative electrode collector and non-aqueous secondary cell
abstract It is an object of the invention to provide the negative material of a kind of reduction of tensile strength during heat treatment of high temperature even in implemented for long periods also few surface treatment copper foil, the manufacture method of surface treatment copper foil, the collector for employing the surface treatment copper foil and non-aqueous secondary cell.To achieve these goals, the present invention provides a kind of surface treatment copper foil, the surface treatment copper foil is that, on the two sides for the copper foil for being more than 100ppm containing the micro constitutent more than one or both of carbon, sulphur, chlorine and nitrogen and its total amount, the Zn content with every one side is 20mg/m 2 ~1000mg/m 2 Surface-treated layer surface treatment copper foil, it is characterised in that the pre-anneal treatment that the temperature range implemented to the surface treatment copper foil at 200 DEG C~280 DEG C is heated.
priorityDate 2012-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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