| abstract |
The present invention provides a kind of semiconductor package parts, comprising: contact pad；Device outside contact pad；And the solder projection on contact pad.The device has conductive contact pads corresponding with contact pad.Contact pad is connect by the solder projection with conductive contact pads.Solder projection includes the height and width from the top of solder projection to contact pad, which is most wide size of the solder projection on the direction perpendicular to height.Joint portion close to the solder projection of contact pad includes hourglass shape.The present invention relates to semiconductor package assembly and a manufacturing method thereof. |