http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104650740-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104650740-B |
| titleOfInvention | A kind of polishing fluid of achievable fast and stable polishing |
| abstract | The invention discloses a kind of polishing fluid of achievable fast and stable polishing, belong to chemical-mechanical polishing of semiconductor field.Main component in the present invention includes silica abrasive grain, alkaline corrosion agent, polyether amine stabilizer and soluble-salt.The polishing fluid electrical conductivity of the present invention is more than 30ms/cm, decompose and take away in time using strong electrolysis in polishing fluid under the conditions of polyelectrolyte and insoluble matter is produced in polishing process, remain the polishing cloth surface of the higher silicon wafer surface of activity and noresidue, it is ensured that the stabilization of polishing process is quickly removed.Polishing fluid of the present invention can reach 1.5 μm/more than min, be 1.5 times of general commercial polishing fluid under equal process conditions. |
| priorityDate | 2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 209.