| abstract |
Provided is a solder alloy having the excellent wettability and joinability needed for use in electronic device assembly and the like and high joining reliability without substantially restricting the alloy composition. Also provided is an electronic device in which the solder alloy has been used to join the electronic parts. The solder alloy has an oxide layer thickness of 120 nm or less and a surface roughness (Ra) of 0.60 [mu]m or less. Although there are no particular restrictions to the alloy composition thereof, preferably the main component of the composition is Bi, Pb, Sn, Au, In, or Zn. |