http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104629642-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate | 2015-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104629642-B |
| titleOfInvention | A kind of preparation method of the epoxide resin conductive adhesive for LED chip bonding |
| abstract | The present invention relates to the preparation method of a kind of epoxide resin conductive adhesive for LED chip bonding, belong to conducting resinl technical field.Step: by weight, after modified epoxy, bisphenol A type epoxy resin 45～60 parts, crystalline polyester resin 10～12 parts, epoxy resin diluent 12～15 parts, silver powder 400～700 parts, curing agent 4～9 parts, curing accelerator 4～6 parts, organic solvent 4～15 parts, antioxidant 3～5 parts are mixed, then through grinding；Wherein, modified epoxy is by 3 methyl catechols, tartronic acid, m-trifluoromethyl phenol and 4, and the mixture of 4 ' dihydroxybiphenyls and chloropropylene oxide carry out epoxidation reaction and prepare.After the present invention is by being modified epoxy resin, make the conductance of the conducting resinl prepared be improved, also make its heat conduction and shear strength be improved simultaneously. |
| priorityDate | 2015-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 107.