http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104599978-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-48 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
filingDate | 2014-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-104599978-B |
titleOfInvention | The preparation method of high salient point tin ball is prepared between a kind of spacing small on flip chip base plate |
abstract | The invention belongs to chip tin ball preparation technology, it discloses the preparation method that high salient point tin ball is prepared between a kind of spacing small on flip chip base plate, step is:First time paste solder printing → first time Reflow Soldering → flux cleaning → first time tin ball flattens → second paste solder printing → second of Reflow Soldering → flux cleaning → second of tin ball pressing → tin ball and checked.The present invention is on the basis of existing paste solder printing engineering method equipment, pass through secondary printing technological process, higher salient point tin ball can be produced between the small spacing of pad, and the connection reliability between chip and substrate is good, and new equipment investment need not be increased, so as to correspond to the diversified salient point tin ball height specification requirement of client more fully hereinafter;Using the technique, salient point tin ball can be made and be spaced about 100~150 μm, product of the tin ball highly for 25 40 μm. |
priorityDate | 2014-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.