| abstract |
The present invention provides that a kind of high hardness of solidfied material, heat-resisting coloring, resistance to UV colorings, intensity, amount of deflection are excellent, even if damaging of encapsulating under backflow, thermal cycle is also few to be suitable to field of electronic materials, the hot curing resin composition of optical semiconductor sealing and the epoxy silicone resin used in which.It is 200～2000 that the present invention provides epoxide equivalent (g/eq), and the epoxy silicone resin that represented by formula (1) and the hot curing resin composition containing which.In formula, R 1 、R 2 For alkyl, E 1 It is the organic residue with epoxy radicals, Z is divalent group. |