abstract |
The invention discloses a heat-curable solder resist composition. The heat-curable solder resist composition comprises (a) 60-100 parts by weight of epoxy resin, (b) 1-10 parts by weight of curing agent, (c) 1-10 parts by weight of catalyst, and (d) 30-40 parts by weight of flexibilizer, wherein the epoxy resin comprises at least one styrene or methylene amine liquid crystal epoxy resin which accounts for 40-100% of the mass of the total epoxy resin. The heat-curable solder resist composition is capable of forming a solder resist film with excellent heat resistance and flexing tolerance, and functions in protecting circuit boards during manufacturing. |