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filingDate 2014-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d3679dc85df8d46f4771cc9950ad5bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e0e8716a1b5401d5a707cca26cfc849
publicationDate 2015-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104559056-A
titleOfInvention Heat-curable solder resist composition and flexible printed circuit board
abstract The invention discloses a heat-curable solder resist composition. The heat-curable solder resist composition comprises (a) 60-100 parts by weight of epoxy resin, (b) 1-10 parts by weight of curing agent, (c) 1-10 parts by weight of catalyst, and (d) 30-40 parts by weight of flexibilizer, wherein the epoxy resin comprises at least one styrene or methylene amine liquid crystal epoxy resin which accounts for 40-100% of the mass of the total epoxy resin. The heat-curable solder resist composition is capable of forming a solder resist film with excellent heat resistance and flexing tolerance, and functions in protecting circuit boards during manufacturing.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016078432-A1
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type http://data.epo.org/linked-data/def/patent/Publication

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