http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104498951-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate | 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104498951-B |
| titleOfInvention | Oxydol etching solution for copper-molybdenum alloy films |
| abstract | The invention discloses an oxydol etching solution for copper-molybdenum alloy films. The etching solution is free of fluorides, and comprises the following main components in percentage by weight: 1-35% of hydrogen peroxide, 0.05-5% of inorganic acid, 0.1-5% of hydrogen peroxide stabilizer, 0.1-5% of metal chelator, 0.1-5% of etching additive, 0.1-5% of surfactant, 0.1-5% of defoaming agent and the balance of deionized water. The etching solution has the advantages of no environment pollution, mild and controllable reaction, proper cone angle after etching, small CD loss, favorable defoaming property and higher overall performance, and lays foundation for high-precision processing. |
| priorityDate | 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.