| abstract |
This electroless gold plating method, which has a step for forming a foundational alloy layer, and a step for directly forming a gold plate layer on the foundational alloy layer by means of electroless reduction plating using a non-cyanide gold plating bath, is characterized by the foundational alloy layer being an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag, and Ru, and M3 is at least one element selected from P and B). |