http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104428452-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2013-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104428452-B |
| titleOfInvention | Additives for producing copper electrodeposits having low oxygen content |
| abstract | A copper electroplating bath for producing copper electrodeposits is described, The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl5 aryl or atkylaryl diamine. The copper electroplating bath can be used for producing eleetroformed copper deposits having low oxygen content, |
| priorityDate | 2012-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.