http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104427757-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104427757-B |
| titleOfInvention | The manufacturing method of surface treatment copper foil, Copper foil with carrier, laminated plates, printed wiring board, e-machine and printed wiring board |
| abstract | The invention discloses the manufacturing methods of surface treatment copper foil, Copper foil with carrier, laminated plates, printed wiring board, e-machine and printed wiring board.The surface treatment copper foil of the present invention is to form roughening particle in a copper foil surface and/or two copper foil surfaces by roughening treatment, about the roughening particle on roughening treatment surface, major diameter is that 100nm roughening particle per unit areas below are formed with 50/μm 2 More than, 60 degree of glossiness of the MD on roughening treatment surface are 76~350%, and roughening treatment surface is contained selected from by element more than any one of Ni, Co group formed, and in the case where Ni is contained on roughening treatment surface, the adhesion amount of Ni is 1400 μ g/dm 2 Hereinafter, in the case where Co is contained on roughening treatment surface, the adhesion amount of Co is 2400 μ g/dm 2 Below.The present invention provides a kind of be bonded well with resin, and the transparency of the resin after etching removes copper foil is excellent, the few surface treatment copper foil of the transmission loss of signal and use its laminated plates. |
| priorityDate | 2013-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 113.