http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104402488-B

Outgoing Links

Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B37-02
filingDate 2014-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104402488-B
titleOfInvention Cover the preprocess method of copper aluminium nitride substrate
abstract The invention discloses the preprocess method of the critical process of aluminium nitride DBC plate preparation process-cover copper aluminium nitride substrate, the method comprises: the first step, aluminium nitride substrate surface clean; Second step, aluminium nitride substrate surface active, makes aluminium nitride expose that make new advances, active high surface by alkali lye; 3rd step, prepared by aluminium nitride substrate surface depletion layer, transition zone is the composite bed containing manganese, copper, calcium, aluminium ion etc.; 4th step, thermal oxidation is carried out on aluminium nitride substrate surface, forms composite modified layer.Present invention reduces the pretreated harsh conditions of aln surface in aluminium nitride DBC technique; The aluminium nitride transition zone of preparation is combined oxidation layer, fully can soak, sprawl by cupric oxide that is smooth and anaerobic copper sheet surface under high temperature, and the formation bonding that reacts, between aluminium nitride and copper sheet, adhesive force intensity is high, hole ratio is low, and product resisting temperature cycle performance is good.
priorityDate 2014-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 47.