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filingDate 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104396005-B
titleOfInvention For the high conductivity high frequency through hole of electronic system
abstract A kind of through-silicon-via conductive in high frequency is described.In one example, through hole includes at least part of passage Jing Guo silicon bare crystalline.First conductive layer has the first electrical conductivity.Second conductive layer covers the outer surface of the first conductive layer, and with second electrical conductivity higher than the first electrical conductivity.
priorityDate 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.