Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53276 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53276 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
filingDate |
2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-104396005-B |
titleOfInvention |
For the high conductivity high frequency through hole of electronic system |
abstract |
A kind of through-silicon-via conductive in high frequency is described.In one example, through hole includes at least part of passage Jing Guo silicon bare crystalline.First conductive layer has the first electrical conductivity.Second conductive layer covers the outer surface of the first conductive layer, and with second electrical conductivity higher than the first electrical conductivity. |
priorityDate |
2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |