http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104342747-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2014-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104342747-B |
| titleOfInvention | Apparatus and method for maintaining pH in nickel electroplating baths |
| abstract | This document relates to an apparatus and method for maintaining pH in a nickel electroplating bath, and specifically discloses an electroplating system for electroplating nickel on a semiconductor substrate, the system having an electroplating unit for containing an electrolyte solution during electroplating, the The electroplating cell includes a cathode compartment and an anode compartment configured to hold a nickel anode, and has an oxygen scavenging device configured to flow electrolyte solution to the anode compartment during electroplating and during idle times when the system is not electroplating reduce the oxygen concentration in the electrolyte solution. Also disclosed herein is a method of electroplating nickel on a substrate in an electroplating cell having an anode compartment and a cathode compartment, the method comprising: reducing the oxygen concentration in an electrolyte solution; flowing an electrolyte solution into the anode compartment and contacting the anode compartment a nickel anode in the chamber; and electroplating nickel from the electrolyte solution onto the substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5. |
| priorityDate | 2013-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.