| abstract |
The invention discloses a preparation method of a double-component addition-type organic silicon heat-conducting potting adhesive. The double-component addition-type organic silicon heat-conducting potting adhesive comprises a component A and a component B. The preparation method comprises the following steps: mixing a heat-conducting filler, a nano additive, a dispersion stabilizer and part of base polymer, heating to 130-160 DEG C to react, and cooling to obtain a base mixture; and respectively mixing the base mixture with the rest of components to obtain the components A and B, thereby obtaining the double-component addition-type organic silicon heat-conducting potting adhesive, wherein the dispersion stabilizer is hydroxy organopolysiloxane. By combining the nano additive and hydroxy organopolysiloxane and performing multiple-step mixing and high-temperature treatment, the phenomena of precipitation and hardening of the filler in the potting adhesive after long-time placement can be effectively reduced, and the storage stability of the potting adhesive with high proportion of heat-conducting filler is improved. |