http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104241201-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-77 |
| filingDate | 2014-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104241201-B |
| titleOfInvention | A kind of method of integrated power device and control device |
| abstract | The present invention relates to ic manufacturing technology field, more particularly to a kind of method of integrated power device and control device, by the method for the present invention, power chip and control chip separate design and making can be made, ensure its performance, the advantage of cost, while not using line and conventional encapsulation with regard to the interconnection of control circuit and chip device can be completed；And by shared thinning and back metal technique, further reduction manufacturing cost, while the performance of power device is improve, and due to having thickeied the metal of power device back-side drain, so as to further reduce the conducting resistance of device. |
| priorityDate | 2014-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.