| abstract |
Embodiments of the present disclosure are directed to techniques and configurations of hierarchical interconnect structures for bridge interconnects in integrated circuit assemblies. In one embodiment, a device may include a substrate and a bridge embedded in the substrate. The bridge can be configured to carry electrical signals between the two dies. The interconnect structure electrically coupled to the bridge may include: a via structure including a first conductive material; a barrier layer including a second conductive material disposed on the via structure; and a solderable material comprising a second conductive material disposed on the barrier layer. on the third conductive material. The first conductive material, the second conductive material and the third conductive material may have different chemical compositions. Other embodiments may be described and/or claimed. |