http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104212167-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B19-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 |
| filingDate | 2014-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104212167-B |
| titleOfInvention | A kind of preparation and its application of low cost low-k thermosetting resin |
| abstract | The present invention relates to method and the applications of a kind of synthesis of the novel phenolic resins containing phenylate structure (thermoplasticity and thermosetting property) and its modified heat convertible resin.The resin is obtained by 2 kinds in cyanate, epoxy resin, the phenolic resin containing phenylate structure or 3 kinds by co-curing behavior.The group of the resin raw material becomes in cyanate, epoxy resin, the phenolic resin containing phenylate structure 2 kinds or 3 kinds, and the mass percent of component is：Cyanate：10 ~ 99%, epoxy resin：0% ~ 100%, novel phenolic resins：10~100%.The thermosetting resin of the present invention has excellent dielectric properties and high impact strength, has a wide range of applications in fields such as high performance print wiring boards. |
| priorityDate | 2014-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.