| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2013-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-104185880-B |
| titleOfInvention |
Liquid composition, copper metal film, conductive wiring line, and method for producing copper metal film |
| abstract |
Provided is a copper metal film which has less voids and good electrical conductivity, while exhibiting good adhesion to a base. A liquid composition which contains (a) at least one substance that is selected from the group consisting of formic acid and copper formate, (b) copper oxide particles and (c) a solvent. |
| priorityDate |
2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |