| abstract |
The present invention provides a kind of adaptation improved to cooling body, and can realize the semiconductor device of production efficiency raising and the manufacture method of semiconductor device.Semiconductor device is that three power semiconductor modulars (1) are arranged at predetermined intervals in the same plane, the pin-shaped electric conductor (25~27) drawn from power semiconductor modular (1) to outside is connected with three main side daughter boards (2A~2C) respectively, so as to which they form the composite module of an entirety.Whole composite module is accommodated in containment vessel; in the case of further configuring fin; containment vessel and fin are coupled by using the bolt for being inserted into through hole (29), the bottom surface of insulated substrate can be made reliably closely sealed with fin and stored in a protective case. |