| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382 |
| filingDate |
2013-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a41b378af6ee82a27daa7f21738f169
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87d7b9ad64f60e219422dda68a53b90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_450144bf45c60ec7999e375468d5528f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bde6c4677ade57d6a6b6e34ed1356ec0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c72740422160a7def8361683b71c803b |
| publicationDate |
2014-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-104160792-A |
| titleOfInvention |
Method for manufacturing printed wiring board and copper foil for laser processing |
| abstract |
An objective of the present invention is to provide a method for manufacturing a printed wiring board that has fewer manufacturing steps, has superior laser processing properties, and can satisfactorily form a wire pattern; and a copper foil for laser processing and a copper clad laminate. To achieve this objective, the method for manufacturing a printed wiring board according to the present invention is a method in which via holes for interlayer connections are formed by directly irradiating infrared laser light onto a readily-meltable laser absorption layer of a laminated body. In the laminated body, copper foil for laser processing provided on the surface thereof with the readily-meltable laser absorption layer which absorbs infrared laser light and has a faster etching rate with respect to copper etching fluid than the copper foil, and another conductive layer, are laminated with the interposition of an insulating layer. The readily-meltable laser absorption layer is removed from the surface of the copper foil in a desmearing step for removing smears in the via holes and/or a micro-etching process which serves as a pretreatment for an electroless plating step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112312659-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110351998-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107404804-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108702847-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106255319-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10763031-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105008594-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108702847-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104519679-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106255319-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11600430-B2 |
| priorityDate |
2012-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |