http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104152879-B
Outgoing Links
Predicate | Object |
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classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36 |
filingDate | 2014-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-104152879-B |
titleOfInvention | A kind of manufacture method of the Copper Foil being coated with resistive material |
abstract | The present invention provides the manufacture method of the Copper Foil being coated with resistive material, the non-surfacing of Copper Foil is arranged protective layer, Copper Foil is carried out pre-treatment, plate impedance material layer finally by chemical plating.By sticking photosensitive dry film or micro-mucous membrane in non-surfacing, or plate the impedance material as protective layer, it is possible to non-surfacing is protected, so that follow-up technical process will not occur error, make the following process better quality of non-surfacing.Surfacing carrying out pre-treatment when surfacing can be made to carry out chemical plating, quality of coating is more preferable.Using chemical plating to plate impedance material layer, technological operation is convenient, and coating is uniform, stable, and technical conditions require relatively simple, and cost is relatively low. |
priorityDate | 2014-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.