http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104152297-B

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Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-5004
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-08
filingDate 2011-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104152297-B
titleOfInvention Cleaning combination, the manufacturing method of semiconductor device and cleaning method
abstract The present invention provides the manufacturing method and cleaning method of a kind of cleaning combination that the removability of the plasma etching residue on the corrosion of metal and semiconductor substrate of semiconductor substrate and/or ash residue can be inhibited excellent and the semiconductor device using the cleaning combination.The manufacturing method and cleaning method of a kind of cleaning combination and the semiconductor device using the cleaning combination, it is characterized in that, the composition is the cleaning combination for removing the plasma etching residue being formed on semiconductor substrate and/or ash residue, it includes (ingredient a) water, (ingredient b) amine compounds, (ingredient c) azanol and/or its salt, (ingredient d) quaternary ammonium compound, (ingredient e) organic acid and (ingredient f) water-miscible organic solvent, and pH is 6~9.
priorityDate 2010-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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