http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104137250-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2013-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104137250-B |
| titleOfInvention | Structure and method for strain-relieved tsv |
| abstract | A semiconductor die including strain relief for through substrate vias (TSVs). The semiconductor die includes a semiconductor substrate having an active face. The semiconductor substrate includes conductive layers connected to the active face. The semiconductor die also includes a through substrate via extending only through the substrate. The through substrate via may include a substantially constant diameter through a length of the through substrate via. The through substrate via may be filled with a conductive filler material. The semiconductor die also includes an isolation layer surrounding the through substrate via. The isolation layer may include two portions: a recessed portion near the active face of the substrate capable of relieving stress from the conductive filler material, and a dielectric portion. A composition of the recessed portion may differ from the dielectric portion. |
| priorityDate | 2012-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.