http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104137249-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67259 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 |
| filingDate | 2013-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104137249-B |
| titleOfInvention | The measurement and control of Waffer edge |
| abstract | The apparatus and method that substrate (such as making wafer floats in gas thin layer) for positioning and/or rotating non-solid contact is provided.Wafer position and rotary speed are determined because each part with processing chamber housing is without solid contact, therefore using each feature structure on chip.Closed-loop control system is provided with capacitance type sensor, with the position of monitoring wafer edge in a horizontal plane.Control system can also when afer rotates monitoring wafer feature structure position, the recess in such as monitoring wafer edge.Because the presence of recess may interrupt the sensor towards Waffer edge, therefore also provide the method and apparatus for reducing or eliminating this interruption. |
| priorityDate | 2012-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.