http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104120432-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c9658351623fec8d8a852d174bd5ce4c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-20 |
| filingDate | 2014-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb29cc505f8a54c9f23f1a1b1f1e1507 |
| publicationDate | 2014-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104120432-A |
| titleOfInvention | Treatment fluid for oxidation film positioned on surface of copper alloy |
| abstract | The invention discloses a treatment fluid for an oxidation film positioned on a surface of a copper alloy, and the treatment fluid is mainly used for solving the problems that harmful gases can be generated and metal self can be damaged when a copper oxidation film is removed in an acidic way at present. The treatment fluid mainly comprises the following components: a component A and a component B, wherein the component A comprises 0.6-0.8 g/L hypophosphite, 1.5-2.4 g/L hydrazine, 0.2-0.3 g/L dihydric phosphate and the balance of water; the component B comprises 3-5 mol/L sulfuric acid, 0.6-0.8 g/L chromic anhydride and the balance of water. The treatment fluid disclosed by the invention has the advantages that the effect on removing the oxidation film positioned on a metal surface is good, the brightness of the metal surface subjected to oxidation film removal is high, and the like. |
| priorityDate | 2014-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.