http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104098906-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12a7355b3d88d9992c7d7f1e63abc869 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-04 |
| filingDate | 2014-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_102c9901f9b6d0e1585b5bea277a0d44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58d2386396b9a9ac552d72f4792b6b2f |
| publicationDate | 2014-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104098906-A |
| titleOfInvention | Single-component addition type liquid silicone rubber for protecting electronic packaging chips |
| abstract | The invention discloses a single-component addition type liquid silicone rubber for protecting electronic packaging chips. The single-component addition type liquid silicone rubber for protecting electronic packaging chips is prepared from the following raw materials in parts by weight: 70-90 parts of vinyl-terminated silicone fluid, 4-6 parts of a methyl hydrogen silicone oil cross-linking agent, 10-30 parts of ethenyl hydrogen-containing silicone, 5-10 parts of filling materials, 1.5-2.5 parts of a thickening agent, 0.5-0.7 part of low-decomposition-temperature organic peroxide, 0.4-0.6 part of a high-decomposition-temperature organic peroxide restrainer and 0.02-0.05 part of a catalyst. According to the single-component addition type liquid silicone rubber, semi-conductor integrated chips subjected to bonding are coated with the liquid silicone rubber, through the adoption of the methods of middle-low temperature preliminary solidification and high temperature deep solidification, the electronic packaging chips are protected; therefore, the purposes of protecting electronic packaging chips during process and the plastic package compression molding process, and increasing the qualified rate of the product quality can be realized. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11655367-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105778515-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111295422-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111295422-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112694865-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111171577-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111171577-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105219100-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11390715-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111607353-A |
| priorityDate | 2014-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.