http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104072990-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F291-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L35-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F291-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-10 |
| filingDate | 2013-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104072990-B |
| titleOfInvention | Resin combination, use its semi-solid preparation film, laminated plates and printed circuit board (PCB) |
| abstract | The present invention provides a kind of resin combination, uses its semi-solid preparation film, laminated plates and printed circuit board (PCB) resin combination, and wherein resin combination comprises: the cyanate ester resin of (A) 100 weight portion；(B) styrene maleic anhydride copolymer of 5 to 80 weight portions；(C) the styrene butadiene divinylbenzene ter-polymers of 15 to 80 weight portions；And the acrylate compounds of (D) 5 to 60 weight portion, wherein the content of styrene maleic anhydride copolymer, styrene butadiene divinylbenzene ter-polymers and acrylate compounds is all on the basis of the cyanate ester resin of 100 weight portions.The present invention, by comprising specific formula, can reach low-k, low-dielectric loss, high thermal stability and high flame resistance；Semi-solid preparation film or resin molding can be fabricated to, and then reach can be applicable to the purpose of laminated plates and printed circuit board (PCB). |
| priorityDate | 2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 150.