| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc023c4f8e5024d2b0873152f8aebd0a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0191 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4691
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2012-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e1de3d15b8c21a4bb02e828c54989d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5c5042c731d163f8894049aa6c07937
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58e94e9a97a7cbaeaef56daef7aa3060
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf90c76e6468fad392fd57b631852b84 |
| publicationDate |
2014-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-104054402-A |
| titleOfInvention |
Method for production of circuit board involving removal of subregion thereof, and use of such method |
| abstract |
The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids in such a circuit board (1). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110691479-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110691479-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108271313-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10743422-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104735924-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107872925-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104735924-A |
| priorityDate |
2011-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |