| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate |
2012-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-104053737-B |
| titleOfInvention |
The construction adhesive of conduction |
| abstract |
The present invention relates to curable compositions, the assembly of its electronic equipment that can bond safely and fully.The invention particularly relates to conduction curable compositions, its can room temperature and heat up under fast setting. |
| priorityDate |
2011-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |