http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104047036-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-547 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-011 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-02167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104047036-B |
| titleOfInvention | Copper plating solution and production and preparation method thereof |
| abstract | Present invention relates in general to copper plating solutions and production and preparation method thereof.Specifically, the present invention includes the copper plating solution containing copper ion source and conductive salt, wherein the copper plating solution is due to substantially free of chlorion and with 1.7~3.5 pH. |
| priorityDate | 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.