http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104045347-B

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-5436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249969
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-9607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-428
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-58092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-5615
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-5611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B37-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-19
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-56
filingDate 2014-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-104045347-B
titleOfInvention Densified composite, its manufacture method and member for use in semiconductor
abstract A kind of composite is provided, the poor very little of the thermal linear expansion coefficient between the composite and aluminum oxide, and with fully high thermal conductivity factor, compactness and intensity.The densified composite of the present invention includes 37 60 mass % silicon-carbide particle, and each content is below titanium silicide, silicon titanium-carbide and the titanium carbide of the mass percent of the silicon-carbide particle, and the densified composite has less than 1% open porosity.The characteristic of the densified composite includes, and such as 40 570 DEG C of average thermal linear expansion coefficient is 7.2 8.2ppm/K, and thermal conductivity factor is more than 75W/mK, and four-point bending intensity is more than 200MPa.
priorityDate 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007261830-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9989226
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549006
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451572542
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452908191
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9863
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6336889
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451818717
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5360311
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159433
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419545355

Total number of triples: 49.