http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104017327-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L35-06 |
| filingDate | 2013-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-104017327-B |
| titleOfInvention | The resistance to combustion resin combination of phosphorus-nitrogen type halogen-free, prepreg and film, copper foil laminates and its printed circuit board (PCB) |
| abstract | A kind of resistance to combustion resin combination of phosphorus-nitrogen type halogen-free, prepreg and film, copper foil laminates and its printed circuit board (PCB), the resistance to combustion resin combination of the phosphorus-nitrogen type halogen-free includes (A) phosphorus nitrogen epoxy resin, (B) curing agent and (C) extender, it is characterized in that, the phosphorus nitrogen epoxy resin is the compound shown in following formula (1), the curing agent is the compound shown in following formula (2), by using specific phosphorus-nitrogen type resin, it is possible to decrease phosphorus content in constituent and reach good flame-retarding characteristic.The present invention separately provides a kind of prepreg, copper foil laminates and its printed circuit board (PCB). |
| priorityDate | 2013-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.