http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103980463-B
Outgoing Links
Predicate | Object |
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classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B24-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 2014-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2016-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2016-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-103980463-B |
titleOfInvention | A kind of epoxy resin solvent-free low-temperature solidified agent and preparation method thereof and application |
abstract | The invention belongs to epoxy curing agent preparing technical field, disclose a kind of epoxy resin solvent-free low-temperature solidified agent and preparation method thereof and application, this solidifying agent can better be applied in sand-cement slurry and prepare the epoxy grouting material in low temperature and water surrounding.This solidifying agent comprises the component of following mass percent: modified phenolic amine 79.9 ~ 97.2%; Coupling agent 0.8 ~ 5.6%; Toughner 1.7 ~ 9.1%; Defoamer 0.1 ~ 0.9%; Catalyzer 0.2 ~ 4.5%.The present invention introduces thiourea group, by this reaction of thiocarbamide modified amine, polyamine, long alkyl chain phenol and paraformaldehyde generation Manny, synthesizing new containing thiourea group mannich base, improve the solidification rate under low temperature environment, overcome the inferior position of solidifying agent curing efficiency difference under wet surface and open fire existent condition, add silane coupling agent, improve the surface tension of system contact surface, improve curing efficiency under water surrounding. |
priorityDate | 2014-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.