http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103977981-B
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B1-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-10 |
filingDate | 2013-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2018-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2018-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-103977981-B |
titleOfInvention | Improve the device of internal wafer temperature distribution |
abstract | Some embodiments are related to provides the method and apparatus that uniform wafer temperature is distributed without introducing undesired particle on wafer in wafer cleaner instrument.In certain embodiments, wafer cleaner instrument of the invention has the Processing Room for being configured for accommodating semiconductor crystal wafer.Distribution arm provides high-temperature cleaning solution for semiconductor crystal wafer.Opening position of the Heating Cup on the periphery around semiconductor crystal wafer is arranged in Processing Room.Heating Cup produces heat, and the heat makes the elevated amount of outer peripheral temperature of semiconductor crystal wafer more than the elevated amount of temperature at the center of semiconductor crystal wafer, so that the interior temperature distribution of semiconductor crystal wafer becomes uniform.Present invention also offers the device for improving internal wafer temperature distribution. |
priorityDate | 2013-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.