http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103963378-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-02 |
| filingDate | 2014-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103963378-B |
| titleOfInvention | A kind of high heat-conducting type metal-based copper-clad plate and preparation method thereof |
| abstract | The invention discloses a kind of high heat-conducting type metal-based copper-clad plate and preparation method thereof.This high heat-conducting type metal-based copper-clad plate includes a metal-based layer, an insulating barrier and a circuit layer, and described insulating barrier is located between described metal-based layer and described circuit layer, and the prepreg that described insulating barrier is obtained by gluing by glass felt and glue is made.Adopting the metal-based copper-clad plate prepared of structure of the present invention, what glass felt is greatly improved in its insulating barrier makes consumption, and that correspondingly reduces resin in glue and glue makes consumption, so as to improve the thermal diffusivity of product, other performances of product are also highly improved. |
| priorityDate | 2014-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.