http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103944530-A

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filingDate 2014-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91d48b2d1bfd322940246bd2556f4007
publicationDate 2014-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103944530-A
titleOfInvention Method for manufacturing electronic device, electronic device
abstract The invention provides a method for manufacturing an electronic device and the electronic device, in order to manufacture an electronic device preventing a through electrode from being corrosive in a short period. The method for manufacturing the electronic device includes a through electrode forming step S1 of forming a through electrode 3 on an insulating base substrate; an electronic element mounting step S2 of mounting an electronic element on one surface of the base substrate 2; a cover body placing step S3 of bonding a cover body 6 accommodating the electronic element 5; a conductive film forming step S4 of forming a conductive film 4 on the other surface LS of the base substrate 2 and on an end face M of the through electrode 3 exposing on the other surface; an electrode pattern forming step S5 of forming an electrode pattern 15 on the end face M of the through electrode 3 and on the surface M of the periphery of the end face while leaving the conductive film 4; and an external electrode forming step S6 of forming an external electrode 13 by accumulating an electroless plated film on the surface of the electrode pattern 15 by an electroless plating method.
priorityDate 2013-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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