Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d5ebd9bdc11f7a4b267d7e865d5a84f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H2003-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-883 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02 |
filingDate |
2014-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91d48b2d1bfd322940246bd2556f4007 |
publicationDate |
2014-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-103944530-A |
titleOfInvention |
Method for manufacturing electronic device, electronic device |
abstract |
The invention provides a method for manufacturing an electronic device and the electronic device, in order to manufacture an electronic device preventing a through electrode from being corrosive in a short period. The method for manufacturing the electronic device includes a through electrode forming step S1 of forming a through electrode 3 on an insulating base substrate; an electronic element mounting step S2 of mounting an electronic element on one surface of the base substrate 2; a cover body placing step S3 of bonding a cover body 6 accommodating the electronic element 5; a conductive film forming step S4 of forming a conductive film 4 on the other surface LS of the base substrate 2 and on an end face M of the through electrode 3 exposing on the other surface; an electrode pattern forming step S5 of forming an electrode pattern 15 on the end face M of the through electrode 3 and on the surface M of the periphery of the end face while leaving the conductive film 4; and an external electrode forming step S6 of forming an external electrode 13 by accumulating an electroless plated film on the surface of the electrode pattern 15 by an electroless plating method. |
priorityDate |
2013-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |