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filingDate 2013-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103928307-B
titleOfInvention The forming method of transistor, the forming method of high-K gate dielectric layer
abstract The forming method of a kind of transistor, the forming method of high-K gate dielectric layer, wherein, the forming method of described high-K gate dielectric layer includes: provide the reaction chamber with plasma source gas, places Semiconductor substrate on the base station surface of described reaction chamber;The plasma source gas in reaction chamber is made to form plasma;Being passed through reactant in the reaction chamber with plasma, described reactant includes hafnium hydroxide, zirconium hydroxide and nitrogen;Reactant described in plasma bombardment, forms the high-K gate dielectric layer covering described semiconductor substrate surface, and the material of described high-K gate dielectric layer is the oxygen zirconium hafnium of nitrating.The processing step forming high-K gate dielectric layer is simple, and the quality of high-K gate dielectric layer is good, and heatproof carrier ability is strong.
priorityDate 2013-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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